THERMAL GREASE

• Silicone and non-silicone formulations
• Low bleed and evaporation
• No migration for Tek-Sil® TSG-07NS and Tek-Sil® TSG-26NS
• Thin bond lines (1mil)
• Easy to apply
• Thermal conductivity up to 2.6 W/mºK
• Non-toxic
• Available in pre-filled Syringes: 3cc(6g), 10cc(28g) or 30cc(72g), 1lb(454g) jars
• Custom packaging available

Our Tek-Sil® silicone and non-silicone greases may be used between any heat generating semiconductor and heat sink, in high performance CPU's and power modules to name just a few uses.

Tek-Sil® TSG-07SL and TSG-26SL are highly thermally conductive silicone-based greases. They are non-reactive, maintain a nonflowable composition and offer low thermal resistance. Suited for thin bond line applications.

Tek-Sil® TSG-07NS and TSG-26NS are polysynthetic-based (non-silicone) thermal greases that have high thermal conductivity properties. They are non-migrating and infused with heat conductive metal oxides. Tek-Sil® non-silicone greases offer all the benefits of a silicone grease without contamination problems.